Hiroyuki Kon

Inventor

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Work History

Patent OwnerApplications FiledYear
HONDA MOTOR CO., LTD.
2
2005
MITSUI MINING & SMELTING CO., LTD.
2
2005
DAI-ICHI SEIKO CO., LTD.
2
2014
EM DEVICES CORPORATION
2
2006

Inventor Addresses

AddressDuration
Ageo, JPNov 06, 12 - Nov 06, 12
Fukuoka, JPFeb 12, 15 - Oct 20, 15
Iwate, JPOct 12, 06 - Sep 09, 08
Saitama, JPMay 08, 08 - May 08, 08
Sayama, JPApr 03, 07 - Apr 03, 07
Sayama-shi, JPDec 01, 05 - Dec 01, 05

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
91663052015Coaxial electric connector0
2015/0044,9122015COAXIAL ELECTRIC CONNECTOR5
83040912012Electrodeposited copper foil with carrier foil with a primer resin layer and manufacturing method thereof1
74235042008Electromagnetic relay5
2008/0107,8652008Electrodeposited Copper Foil with Carrier Foil with a Primer Resin Layer and Manufacturing Method Thereof5

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