Wei H Koh

Inventor

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Details

Work History

Patent OwnerApplications FiledYear
Kingston Technology Corp.
2
3
2
4
2
2
2002
2003
2004
2005
2006
2010
KINGSTON TECHNOLOGY COMPANY, INC.
1
2006
Express Packaging Systems, Inc.
1
1997
Grumman Aerospace Corporation
1
4
3
1
1
1990
1991
1994
1995
1996

Inventor Addresses

AddressDuration
Irvine, CADec 24, 91 - May 27, 08
Irvine, CA, USJan 22, 04 - Dec 06, 11

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
C03B: MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
80718952011Waterproof USB drives and method of making8
77818732010Encapsulated leadframe semiconductor package for random access memory integrated circuits4
77812992010Leadframe semiconductor package stand and method for making the same1
2010/0124,0102010WATERPROOF USB DRIVES AND METHOD OF MAKING12
75643592009Memory module and card with integrated RFID tag9

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