Masahiko Kobayakawa

Inventor

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Details

Work History

Patent OwnerApplications FiledYear
ROHM CO., LTD.
4
8
5
2
6
1
6
17
6
8
15
10
8
12
6
5
4
2001
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2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017

Inventor Addresses

AddressDuration
Kyoto, JPAug 23, 01 - Jan 07, 25
Kyoto-Shi, JPJan 30, 03 - Jan 30, 03
Kyoto-shi, JPNov 13, 03 - Mar 27, 25

Technology Profile

Technology Matters
B26D: CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 1
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1
F21K: LIGHT SOURCES NOT OTHERWISE PROVIDED FOR 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2025/0107,3052025SEMICONDUCTOR DEVICE WITH IMPROVED HEAT DISSIPATION0
2025/0063,8762025SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME0
121914352025Semiconductor light-emitting device0
121661622024Semiconductor light emitting device and method for manufacturing the same0
2023/0420,6292023SEMICONDUCTOR LIGHT-EMITTING DEVICE0

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