Daisuke Kitagawa
Inventor
Stats
- 7 US patents issued
- 21 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 21 US Applications Filed
- 81 Total Citation Count
- Jun 12, 2024 Most Recent Filing
- Jun 16, 2008 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
OMRON AUTOMOTIVE ELECTRONICS CO., LTD. | 2
| 2012
|
TS TECH CO., LTD. | 1
2 1 | 2013
2014 2015 |
NITTO DENKO CORPORATION | 2
1 2 1 4 2 | 2008
2009 2010 2011 2012 2014 |
NATIONAL UNIVERSITY CORPORATION KYOTO INSTITUTE OF TECHNOLOGY | 2
| 2008
|
Inventor Addresses
Address | Duration |
---|---|
Ibaraki, JP | May 31, 22 - Jan 17, 23 |
Ibaraki-shi, JP | Dec 10, 20 - Dec 30, 21 |
Iida, JP | Nov 25, 14 - Nov 25, 14 |
Osaka, JP | Aug 12, 10 - Feb 18, 25 |
Shioya-gun, JP | Nov 12, 15 - Nov 12, 15 |
Tochigi, JP | May 19, 16 - Nov 12, 19 |
Tokyo, JP | Oct 19, 21 - Oct 19, 21 |
Yokkaichi Mie, JP | Dec 19, 24 - Dec 19, 24 |
lida-shi, JP | Dec 27, 12 - Dec 27, 12 |
Technology Profile
Technology | Matters | |
---|---|---|
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 4 |
B29K: | INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12232282 | 2025 | Ventilation housing | 0 |
2024/0422,982 | 2024 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 0 |
11963317 | 2024 | Ventilation assembly and ventilation housing | 0 |
11554524 | 2023 | Method for manufacturing supporting body | 0 |
11525567 | 2022 | Ventilation housing | 2 |
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