Noyan Kinayman
Inventor
Stats
- 11 US patents issued
- 15 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 11 US Patents Issued
- 15 US Applications Filed
- 444 Total Citation Count
- Mar 28, 2018 Most Recent Filing
- Mar 30, 1999 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
ANOKIWAVE, INC. | 1
| 2015
|
COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION | 2
4 | 2002
2003 |
MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2
| 2015
|
Mia-Com, Inc. | 1
| 2002
|
M/A-COM | 5
| 2002
|
MA-COM, INC. | 1
| 2002
|
Teraburst Networks, Inc. | 2
| 2002
|
AUTOLIV ASP, INC. | 1
1 4 2 | 1999
2000 2002 2003 |
Inventor Addresses
Address | Duration |
---|---|
Boston, MA | Mar 13, 01 - Mar 13, 01 |
Harvard, MA, US | Sep 27, 16 - Nov 03, 20 |
Lexington, MA, US | Apr 06, 17 - Oct 10, 17 |
Malden, MA | Jun 03, 03 - Feb 14, 06 |
Malden, MA, US | Apr 24, 03 - Jan 27, 05 |
Technology Profile
Technology | Matters | |
---|---|---|
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 8 |
H01P: | WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE | 7 |
H01Q: | AERIALS | 3 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
10826195 | 2020 | Apparatus and method for RF isolation in a packaged integrated circuit | 3 |
10777888 | 2020 | Beamforming integrated circuit with RF grounded material ring | 1 |
10587044 | 2020 | Flip-chip beamforming integrated circuit with integral thermal mass | 2 |
2018/0287,266 | 2018 | Apparatus and Method for RF Isolation in a Packaged Integrated Circuit | 9 |
2018/0115,356 | 2018 | Flip-Chip Beamforming Integrated Circuit with Integral Thermal Mass | 7 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.