KyungOe Kim
Inventor
Stats
- 17 US patents issued
- 31 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 17 US Patents Issued
- 31 US Applications Filed
- 165 Total Citation Count
- Aug 27, 2024 Most Recent Filing
- Jul 10, 2006 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
STATS CHIPPAC LTD. | 1
| 2006
|
STATS CHIPPAC, INC. | 2
| 2006
|
STATS CHIPPAC PTE. LTE. | 4
2 4 4 2 5 3 3 1 | 2006
2007 2008 2009 2011 2012 2013 2014 2015 |
Inventor Addresses
Address | Duration |
---|---|
Daegeon City, KR | May 10, 07 - Oct 02, 14 |
Daegeon city, KR | Jan 17, 08 - Jan 01, 09 |
Daegeon, KR | Feb 09, 10 - Sep 26, 17 |
Daejeon, KR | Jun 20, 13 - Oct 23, 18 |
Icheon City, KR | Sep 24, 09 - Sep 24, 09 |
Icheon, KR | Oct 16, 12 - Oct 16, 12 |
Incheon, KR | Dec 15, 22 - Feb 04, 25 |
Kyoung-gi-Do, KR | Dec 14, 10 - Dec 14, 10 |
Kyoung-gi-do, KR | Sep 24, 09 - Sep 24, 09 |
Kyoungki-do, KR | Feb 14, 12 - Feb 14, 12 |
Technology Profile
Technology | Matters | |
---|---|---|
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
G06T: | IMAGE DATA PROCESSING OR GENERATION, IN GENERAL | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 31 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12218114 | 2025 | Semiconductor device and method of making a photonic semiconductor package | 0 |
2024/0421,024 | 2024 | Thermally Enhanced FCBGA Package | 0 |
12107028 | 2024 | Thermally enhanced FCBGA package | 0 |
12074135 | 2024 | Semiconductor device and method of controlling warpage during LAB | 0 |
2024/0170,422 | 2024 | Die-Beam Alignment for Laser-Assisted Bonding | 0 |
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