KyungOe Kim

Inventor

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Stats

Details

Work History

Patent OwnerApplications FiledYear
STATS CHIPPAC LTD.
1
2006
STATS CHIPPAC, INC.
2
2006
STATS CHIPPAC PTE. LTE.
4
2
4
4
2
5
3
3
1
2006
2007
2008
2009
2011
2012
2013
2014
2015

Inventor Addresses

AddressDuration
Daegeon City, KRMay 10, 07 - Oct 02, 14
Daegeon city, KRJan 17, 08 - Jan 01, 09
Daegeon, KRFeb 09, 10 - Sep 26, 17
Daejeon, KRJun 20, 13 - Oct 23, 18
Icheon City, KRSep 24, 09 - Sep 24, 09
Icheon, KROct 16, 12 - Oct 16, 12
Incheon, KRDec 15, 22 - Feb 04, 25
Kyoung-gi-Do, KRDec 14, 10 - Dec 14, 10
Kyoung-gi-do, KRSep 24, 09 - Sep 24, 09
Kyoungki-do, KRFeb 14, 12 - Feb 14, 12

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2
G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 31

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
122181142025Semiconductor device and method of making a photonic semiconductor package0
2024/0421,0242024Thermally Enhanced FCBGA Package0
121070282024Thermally enhanced FCBGA package0
120741352024Semiconductor device and method of controlling warpage during LAB0
2024/0170,4222024Die-Beam Alignment for Laser-Assisted Bonding0

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