Lily Khor
Inventor
Stats
- 7 US patents issued
- 11 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 11 US Applications Filed
- 452 Total Citation Count
- Sep 10, 2019 Most Recent Filing
- Jul 20, 2001 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| CARSEM SEMICONDUCTOR SDN. BHD. | 1
| 2005
|
| CARSEM (M) SDN. BHD. | 1
2 2 2 | 2001
2003 2005 2009 |
| Carsem (M) Sdn. Bhd. | 1
5 | 2011
2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Ipoh, MY | Mar 26, 15 - Sep 07, 21 |
| Kedah, MY | Feb 17, 05 - Sep 25, 07 |
| Perak, MY | Nov 19, 02 - Jun 02, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G06K: | RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 11 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11114367 | 2021 | Molded integrated circuit packages and methods of forming the same | 0 |
| 2020/0219,800 | 2020 | MOLDED INTEGRATED CIRCUIT PACKAGES | 1 |
| 10468319 | 2019 | Low-profile electronic package | 0 |
| 2018/0211,902 | 2018 | PRE-MOLDED INTEGRATED CIRCUIT PACKAGES | 0 |
| 2018/0150,673 | 2018 | LOW-PROFILE ELECTRONIC PACKAGE | 1 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.