Nee Wan Khoo
Inventor
Stats
- 6 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 10 US Applications Filed
- 21 Total Citation Count
- Aug 17, 2023 Most Recent Filing
- Feb 27, 2013 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 8
2 2 | 2013
2014 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Melaka, MY | Aug 28, 14 - Jan 28, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
| G01R: | MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES | 4 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 7 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12211761 | 2025 | Protector cap for package with thermal interface material | 0 |
| 2024/0302,426 | 2024 | Semiconductor Device Testing with Lead Extender | 0 |
| 2023/0395,442 | 2023 | Protector Cap for Package with Thermal Interface Material | 0 |
| 2023/0314,502 | 2023 | APPARATUS FOR TESTING SEMICONDUCTOR DEVICES AND A ROLLING CONTACTOR FOR USE IN SUCH AN APPARATUS | 0 |
| 11769701 | 2023 | Protector cap for package with thermal interface material | 1 |
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