Viren V Khandekar
Inventor
Stats
- 4 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 5 US Applications Filed
- 85 Total Citation Count
- Sep 24, 2008 Most Recent Filing
- Dec 27, 2004 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| INTEL CORPORATION | 2
1 3 | 2004
2005 2006 |
| MAXIM INTEGRATED PRODUCTS, INC. | 1
| 2008
|
Inventor Addresses
| Address | Duration |
|---|---|
| Chandler, AZ | Nov 14, 06 - Mar 13, 07 |
| Chandler, AZ, US | Jun 29, 06 - Aug 04, 09 |
| Flower Mound, TX, US | Mar 25, 10 - Mar 25, 10 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 5 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2010/0072,615 | 2010 | High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof | 2 |
| 7569939 | 2009 | Self alignment features for an electronic assembly | 8 |
| 7482199 | 2009 | Self alignment features for an electronic assembly | 7 |
| 7190078 | 2007 | Interlocking via for package via integrity | 18 |
| 2007/0013,063 | 2007 | SELF ALIGNMENT FEATURES FOR AN ELECTRONIC ASSEMBLY | 18 |
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