Shuji Kashiwagi
Inventor
Stats
- 2 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 2 US Applications Filed
- 37 Total Citation Count
- Jan 18, 2013 Most Recent Filing
- Dec 24, 2003 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. | 2
| 2003
|
SUMITOMO ELECTRIC INDUSTRIES, LTD. | 1
| 2003
|
ASAHI KASEI E-MATERIALS CORPORATION | 2
| 2013
|
Inventor Addresses
Address | Duration |
---|---|
Kouga-gun, JP | Sep 09, 04 - Feb 22, 05 |
Nagoya, JP | Feb 20, 18 - Feb 20, 18 |
Nagoya-shi, JP | Jan 29, 15 - Jan 29, 15 |
Technology Profile
Technology | Matters | |
---|---|---|
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
C08G: | MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 1 |
C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
9896546 | 2018 | Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same | 2 |
2015/0027,754 | 2015 | RESIN COMPOSITION, LAYERED PRODUCT, MULTILAYER PRINTED WIRING BOARD, MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME | 8 |
6858921 | 2005 | Flexible printed circuit substrate | 11 |
2004/0173,884 | 2004 | Flexible printed circuit substrate | 2 |
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