Shuji Kashiwagi
Inventor
Stats
- 2 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 2 US Applications Filed
- 37 Total Citation Count
- Jan 18, 2013 Most Recent Filing
- Dec 24, 2003 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. | 2
| 2003
|
| SUMITOMO ELECTRIC INDUSTRIES, LTD. | 1
| 2003
|
| ASAHI KASEI E-MATERIALS CORPORATION | 2
| 2013
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kouga-gun, JP | Sep 09, 04 - Feb 22, 05 |
| Nagoya, JP | Feb 20, 18 - Feb 20, 18 |
| Nagoya-shi, JP | Jan 29, 15 - Jan 29, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| C08G: | MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 1 |
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9896546 | 2018 | Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same | 2 |
| 2015/0027,754 | 2015 | RESIN COMPOSITION, LAYERED PRODUCT, MULTILAYER PRINTED WIRING BOARD, MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME | 8 |
| 6858921 | 2005 | Flexible printed circuit substrate | 11 |
| 2004/0173,884 | 2004 | Flexible printed circuit substrate | 2 |
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