Christopher James Kapusta
Inventor
Stats
- 47 US patents issued
- 93 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 47 US Patents Issued
- 93 US Applications Filed
- 1006 Total Citation Count
- Aug 16, 2023 Most Recent Filing
- Mar 15, 2001 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
AMPHENOL THERMOMETRICS, INC. | 2
2 3 | 2001
2002 2015 |
LOCKHEED MARTIN CORPORATION | 3
3 1 | 2002
2006 2008 |
SABIC GLOBAL TECHNOLOGIES B.V. | 1
| 2002
|
GENERAL ELECTRIC COMPANY | 1
4 2 7 7 3 9 10 10 1 5 4 5 2 4 4 3 | 2001
2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 |
Inventor Addresses
Address | Duration |
---|---|
DELANSON, NY | May 29, 08 - May 29, 08 |
Delanson, NY | May 22, 07 - Sep 23, 08 |
Delanson, NY, US | Apr 13, 06 - Feb 20, 25 |
Duanesburg, NY | Aug 06, 02 - Dec 16, 08 |
Duanesburg, NY, US | Sep 19, 02 - Mar 08, 11 |
Niskayuna, NY, US | Dec 29, 16 - Dec 29, 16 |
Schenectady, NY, US | Nov 26, 15 - Dec 22, 16 |
Technology Profile
Technology | Matters | |
---|---|---|
A47G: | HOUSEHOLD OR TABLE EQUIPMENT | 1 |
A61B: | DIAGNOSIS; SURGERY; IDENTIFICATION | 3 |
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0062,280 | 2025 | POWER OVERLAY STRUCTURE FOR A MULTI-CHIP SEMICONDUCTOR PACKAGE | 0 |
2024/0266,270 | 2024 | POWER OVERLAY PACKAGE FOR A SEMICONDUCTOR DEVICE | 0 |
11982645 | 2024 | Sensor system and method | 0 |
11950394 | 2024 | Liquid-cooled assembly and method | 0 |
2023/0420,901 | 2023 | ELECTRONIC CONNECTION ASSEMBLY | 0 |
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