Tonny Kamphuis
Inventor
Stats
- 14 US patents issued
- 22 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 14 US Patents Issued
- 22 US Applications Filed
- 171 Total Citation Count
- Mar 6, 2017 Most Recent Filing
- Jul 10, 2008 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| NXP B.V. | 2
2 10 6 9 2 1 | 2008
2009 2013 2014 2015 2016 2017 |
| NEXPERIA B.V. | 1
1 | 2014
2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| LENT, NL | Dec 28, 17 - Dec 28, 17 |
| Lent, NL | Jul 22, 10 - May 18, 21 |
| NIijmegen, NL | Jan 07, 16 - Jan 07, 16 |
| Nijmegen, NL | Sep 22, 16 - Jan 08, 19 |
| Nlijmegen, NL | Jan 07, 16 - Jan 07, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G03F: | PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR | 1 |
| G06K: | RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 21 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11011446 | 2021 | Semiconductor device and method of making a semiconductor device | 0 |
| 10177111 | 2019 | Reduction of defects in wafer level chip scale package (WLCSP) devices | 6 |
| 10109564 | 2018 | Wafer level chip scale semiconductor package | 0 |
| 9953903 | 2018 | Heatsink very-thin quad flat no-leads (HVQFN) package | 0 |
| 2017/0372,988 | 2017 | WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGE | 7 |
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