Kazunari Kurita

Inventor

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Work History

Patent OwnerApplications FiledYear
SUMCO CORPORATION
2
7
4
24
7
6
3
3
1
2
2
2004
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
SUMITOMO MITSUBISHI SILICON CORPORATION
2
1
2003
2004
RIDECELL, INC.
2
2008

Inventor Addresses

AddressDuration
Minato-ku, JPFeb 04, 10 - Sep 05, 24
Tokyo, JPJun 22, 06 - Sep 12, 23

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 5
C01B: NON-METALLIC ELEMENTS; COMPOUNDS THEREOF 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0297,2012024METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD OF PRODUCING SOLID-STATE IMAGE SENSING DEVICE0
2024/0282,8012024METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD OF PRODUCING SOLID-STATE IMAGE SENSING DEVICE0
RE496572023Epitaxial wafer manufacturing method and epitaxial wafer0
112450142022Method of producing epitaxial silicon wafer, epitaxial silicon wafer, and method of producing solid-state imaging device0
2021/0083,0582021METHOD OF PRODUCING EPITAXIAL SILICON WAFER, EPITAXIAL SILICON WAFER, AND METHOD OF PRODUCING SOLID-STATE IMAGING DEVICE1

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