Ilhyoung KOO
Inventor
Stats
- 1 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 3 US Applications Filed
- 8 Total Citation Count
- Sep 29, 2021 Most Recent Filing
- Jun 20, 2014 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 1
| 2014
|
Inventor Addresses
| Address | Duration |
|---|---|
| ASAN-SI, KR | Sep 29, 22 - Sep 29, 22 |
| Asan-si, KR | Apr 02, 15 - Dec 04, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 3 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2022/0310,551 | 2022 | SEMICONDUCTOR MANUFACTURING APPARATUS | 0 |
| 10147653 | 2018 | Method of manufacturing a semiconductor device using a mounting apparatus | 0 |
| 2018/0174,928 | 2018 | MOUNTING APPARATUS | 1 |
| 9929061 | 2018 | Mounting apparatus | 3 |
| 2015/0089,801 | 2015 | MOUNTING APPARATUS | 5 |
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