YOUN SUNG KO
Inventor
Stats
- 0 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 10 US Applications Filed
- 9 Total Citation Count
- Mar 27, 2024 Most Recent Filing
- Mar 27, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| PROTEC CO., LTD. | 1
| 2015
|
Inventor Addresses
| Address | Duration |
|---|---|
| CHUNGCHEONGNAM-DO, KR | Oct 01, 15 - Oct 01, 15 |
| Chungcheongnam-do, KR | May 07, 20 - Feb 25, 25 |
| Gyeonggi-do, KR | Jan 11, 24 - Oct 03, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 6 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 8 |
| H01S: | DEVICES USING STIMULATED EMISSION | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12237296 | 2025 | System for laser bonding of flip chip | 0 |
| 12217995 | 2025 | Method of mounting conductive balls using electrostatic chuck | 0 |
| 2024/0332,233 | 2024 | METHOD OF BONDING COLUMN TYPE DEPOSITS | 0 |
| 2024/0314,939 | 2024 | METHOD OF BONDING COLUMN TYPE DEPOSITS | 0 |
| 2024/0178,182 | 2024 | APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING | 0 |
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