Kimin Jun
Inventor
Stats
- 11 US patents issued
- 124 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 11 US Patents Issued
- 124 US Applications Filed
- 455 Total Citation Count
- Nov 8, 2024 Most Recent Filing
- Jun 30, 2011 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| INTEL CORPORATION | 2
10 7 2 1 1 | 2011
2013 2014 2015 2016 2017 |
| MASSACHUSETTS INSTITUTE OF TECHNOLOGY | 2
| 2012
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hillsboro, OR, US | Jan 03, 13 - May 09, 24 |
| Portland, OR, US | Aug 30, 18 - Apr 03, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| C25B: | ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON- METALS; APPARATUS THEREFOR | 1 |
| G01R: | MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES | 4 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0112,127 | 2025 | IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES | 0 |
| 2025/0112,155 | 2025 | CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY | 0 |
| 2025/0112,173 | 2025 | PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES | 0 |
| 2025/0112,177 | 2025 | SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS | 0 |
| 2025/0112,181 | 2025 | BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS | 0 |
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