Jun Hee Jeong

Inventor

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Work History

Patent OwnerApplications FiledYear
HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION
1
2002
SYMBIONT CO., LTD.
1
2002

Inventor Addresses

AddressDuration
Seoul, KRMay 08, 03 - May 08, 03
Yongin-si, KRJul 26, 18 - Dec 31, 19

Technology Profile

Technology Matters
G04G: ELECTRONIC TIME-PIECES 1
G06F: ELECTRIC DIGITAL DATA PROCESSING 1
G06K: RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
105225222019Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same1
104741922019Wearable smart device having flexible semiconductor package mounted on a band18
2018/0210,4912018WEARABLE SMART DEVICE HAVING FLEXIBLE SEMICONDUCTOR PACKAGE MOUNTED ON A BAND20
2018/0211,9432018PACKAGE SUBSTRATE COMPRISING SIDE PADS ON EDGE, CHIP STACK, SEMICONDUCTOR PACKAGE, AND MEMORY MODULE COMPRISING SAME13
2003/0086,4122003VoIP gateway system connected through extension subscriber circuit of private branch exchange5

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