Hyung Jun Jeon
Inventor
Stats
- 13 US patents issued
- 19 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 13 US Patents Issued
- 19 US Applications Filed
- 233 Total Citation Count
- Dec 27, 2023 Most Recent Filing
- Jan 31, 2006 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
LSIS CO., LTD. | 1
| 2012
|
LS INDUSTRIAL SYSTEMS CO., LTD. | 2
6 | 2010
2011 |
STATS CHIPPAC PTE. LTE. | 9
2 2 2 2 | 2006
2008 2009 2010 2011 |
Nethom Co., Ltd. | 2
| 2011
|
Inventor Addresses
Address | Duration |
---|---|
Hwaseong, KR | Apr 28, 11 - Jun 03, 14 |
Hwaseong-si, KR | Nov 22, 12 - Nov 19, 13 |
SEOUL, KR | Nov 17, 22 - Nov 17, 22 |
Seoul, KR | Jul 19, 07 - Apr 01, 25 |
Singapore, SG | Jan 04, 07 - Aug 02, 07 |
Suwon-si, KR | Nov 26, 20 - Nov 14, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
G05B: | CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS | 1 |
G06K: | RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS | 1 |
G08B: | SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12266609 | 2025 | Semiconductor device and method for fabricating the same | 0 |
2024/0379,639 | 2024 | SEMICONDUCTOR PACKAGE | 0 |
2024/0186,247 | 2024 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | 0 |
11728200 | 2023 | Wafer bonding apparatuses | 0 |
2022/0367,364 | 2022 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.