Shin-Puu Jeng
Inventor
Stats
- 280 US patents issued
- 851 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 280 US Patents Issued
- 851 US Applications Filed
- 9902 Total Citation Count
- Dec 13, 2024 Most Recent Filing
- May 16, 1994 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC") | 4
| 2013
|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 1
2 1 4 6 21 21 19 14 52 51 31 60 48 22 30 4 | 1998
2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017 |
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LLC | 1
| 2016
|
| TEXAS INSTRUMENTS INCORPORATED | 4
7 16 7 1 2 1 | 1994
1995 1996 1997 1999 2000 2002 |
| APPLIED MATERIALS, INC. | 4
6 3 3 2 3 3 3 4 | 1998
1999 2000 2001 2002 2003 2004 2005 2007 |
| Taiwan Semiconductor Manufacturing & Company, Ltd. | 1
| 2010
|
Inventor Addresses
| Address | Duration |
|---|---|
| 2508 Evergreen Dr., Plano, TX 75075 | Jan 23, 96 - Jan 23, 96 |
| Baoshan Township, Hsinchu County, TW | Apr 27, 10 - Jan 28, 20 |
| Baoshan Township, TW | Sep 25, 08 - Aug 22, 19 |
| CUPERTINO, CA | Jan 03, 02 - Jan 03, 02 |
| Cupertino, CA | Apr 25, 00 - Mar 13, 08 |
| Cupertino, CA, US | Jul 14, 09 - Jan 26, 10 |
| HSINCHU COUNTY, TW | Nov 30, 17 - Nov 30, 17 |
| HSINCHU, TW | Sep 22, 16 - Jun 20, 24 |
| Hsin-Chu City, TW | Mar 04, 10 - Mar 04, 10 |
| Hsin-Chu, TW | May 29, 07 - Dec 22, 20 |
| Hsin-chu, TW | Apr 09, 09 - Jul 01, 10 |
| Hsinchu City, TW | Oct 27, 05 - Jun 15, 06 |
| Hsinchu County, TW | Mar 27, 08 - Jul 23, 24 |
| Hsinchu, TW | Jul 11, 00 - Apr 03, 25 |
| Plano, TX | Sep 26, 95 - Nov 11, 03 |
| Po-Shan Village, Hsinchu, TW | Jul 02, 20 - Nov 07, 24 |
| Po-Shan Village, TW | Aug 05, 10 - Mar 27, 25 |
| Po-Shan, TW | Mar 05, 20 - Mar 05, 20 |
| Po-Shin Village, TW | Dec 22, 22 - Nov 14, 24 |
| Tainan, TW | Sep 30, 03 - Jul 11, 06 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01F: | MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING | 1 |
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 6 |
| B06B: | GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0112,217 | 2025 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | 0 |
| 12266635 | 2025 | Semiconductor device package having dummy dies | 0 |
| 2025/0105,170 | 2025 | SEMICONDUCTOR PACKAGE INCLUDING STRESS-REDUCTION CHAMFERS AND METHODS FOR FORMING THE SAME | 0 |
| 2025/0105,077 | 2025 | PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 0 |
| 2025/0105,080 | 2025 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE | 0 |
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