Alexander Jansen
Inventor
Stats
- 4 US patents issued
- 21 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 21 US Applications Filed
- 158 Total Citation Count
- Feb 15, 2024 Most Recent Filing
- Aug 8, 2002 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
APPLIED MATERIALS, INC. | 1
1 | 2015
2016 |
ROBERT BOSCH GMBH | 4
| 2005
|
AVERY DENNISON CORPORATION | 1
2 | 2002
2004 |
Inventor Addresses
Address | Duration |
---|---|
Danville, CA, US | Feb 06, 25 - Apr 10, 25 |
SUNNYVALE, CA, US | Apr 06, 17 - Jun 20, 19 |
San Jose, CA, US | Jan 21, 21 - Dec 31, 24 |
Stuttgart, DE | Oct 23, 08 - Jun 14, 11 |
Sunnyvale, CA, US | Oct 04, 16 - Jul 06, 21 |
Zoetermeer, NL | Nov 30, 04 - May 12, 05 |
Technology Profile
Technology | Matters | |
---|---|---|
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 2 |
B08B: | CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL | 2 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0118,563 | 2025 | TITANIUM NITRIDE GAPFILL PROCESSES FOR SEMICONDUCTOR STRUCTURES | 0 |
2025/0046,600 | 2025 | TITANIUM NITRIDE GAPFILL PROCESSES FOR SEMICONDUCTOR DEVICES | 0 |
12183631 | 2024 | Methods for copper doped hybrid metallization for line and via | 0 |
2024/0183,028 | 2024 | METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER SURFACES | 0 |
11939666 | 2024 | Methods and apparatus for precleaning and treating wafer surfaces | 0 |
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