Hideo Izawa

Inventor

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Work History

Patent OwnerApplications FiledYear
MIYAKOSHI PRINTING MACHINERY CO., LTD.
2
1
3
1
6
2
6
10
4
8
21
8
26
16
16
12
4
4
2
1986
1996
1999
2000
2002
2003
2005
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
COMPUWARE CORPORATION
1
1999
SHARP KABUSHIKI KAISHA
1
1
1986
1998
PANASONIC CORPORATION
4
1
2005
2009
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
2
2005
KEIHIN CORPORATION
1
2012

Inventor Addresses

AddressDuration
Chiba, JPOct 30, 01 - Apr 21, 15
Harashino, JPAug 07, 18 - Aug 07, 18
Kitakatsuragi-gun, JPAug 10, 99 - Aug 10, 99
Nara, JPJun 14, 88 - Jun 14, 88
Narashino, JPNov 23, 04 - Mar 01, 22
Narashino-Shi, JPJul 28, 11 - Jul 28, 11
Narashino-shi, Chiba, JPAug 13, 20 - Aug 13, 20
Narashino-shi, JPNov 27, 03 - Sep 17, 20
Sakura, JPSep 01, 98 - Oct 13, 15
Sakura-shi, JPAug 08, 02 - Dec 29, 11
Yachiyo, JPSep 01, 87 - Nov 17, 87

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B26D: CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 3
B31D: MAKING OTHER PAPER ARTICLES 3

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
112606552022Ink-jet printer0
109606732021Inkjet printer0
108434872020Ink drying apparatus for drying ink by heat after printing0
108073862020Printing device0
2020/0290,3442020INK-JET PRINTER0

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