Ken Iyoda
Inventor
Stats
- 4 US patents issued
- 7 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 7 US Applications Filed
- 89 Total Citation Count
- Aug 10, 2021 Most Recent Filing
- Mar 27, 2003 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| DOWA HOLDINGS CO., LTD. | 2
| 2003
|
| DOWA METALTECH CO., LTD. | 4
1 | 2003
2005 |
| DOWA MINING CO., LTD. | 2
1 | 2003
2008 |
Inventor Addresses
| Address | Duration |
|---|---|
| Nagano, JP | Jul 29, 04 - Aug 14, 07 |
| Shiojiri, JP | May 18, 04 - May 18, 04 |
| Shiojiri-city, JP | Oct 02, 03 - Oct 02, 03 |
| Tokyo, JP | Nov 20, 03 - Sep 25, 08 |
| Yokkaichi, JP | Sep 08, 22 - Sep 08, 22 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 2 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| B44C: | PRODUCING DECORATIVE EFFECTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2022/0285,379 | 2022 | SEMICONDUCTOR MEMORY DEVICE | 0 |
| 2008/0230,515 | 2008 | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof | 0 |
| 7387741 | 2008 | Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof | 1 |
| 7256353 | 2007 | Metal/ceramic bonding substrate and method for producing same | 13 |
| 2005/0175,773 | 2005 | Metal/ceramic bonding member and method for producing same | 3 |
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