Keiichi Iwata
Inventor
Stats
- 11 US patents issued
- 12 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 11 US Patents Issued
- 12 US Applications Filed
- 268 Total Citation Count
- Jul 15, 2004 Most Recent Filing
- Sep 26, 1989 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Cyber Solutions Inc. | 1
| 2003
|
| JAPAN PIONICS CO., LTD. | 1
1 1 1 2 | 1989
1990 1992 1993 1994 |
| MITSUBISHI GAS CHEMICAL COMPANY, INC. | 1
1 4 | 1995
1997 2002 |
| NTT DATA CORPORATION | 1
| 2003
|
| MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. | 2
| 2004
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hiratsuka, JP | Jan 03, 95 - Jan 28, 97 |
| Kawasaki-shi, JP | May 06, 04 - May 06, 04 |
| Niigata, JP | Dec 11, 90 - Aug 05, 03 |
| Niigata-ken, JP | Dec 08, 98 - Dec 08, 98 |
| Okayama, JP | Feb 17, 05 - Apr 15, 08 |
| Tokyo, JP | Mar 13, 03 - Nov 28, 06 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01D: | SEPARATION | 5 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| C01B: | NON-METALLIC ELEMENTS; COMPOUNDS THEREOF | 4 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 7357288 | 2008 | Component connecting apparatus | 11 |
| 7140103 | 2006 | Process for the production of high-density printed wiring board | 3 |
| 2005/0034,302 | 2005 | Component connecting apparatus and method and component mounting apparatus | 14 |
| 2004/0085,906 | 2004 | Packet tracing system | 25 |
| 6602654 | 2003 | Developing solution for a photoresist and a method for developing the photoresist | 2 |
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