Eiji Iwamura
Inventor
Stats
- 15 US patents issued
- 19 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 15 US Patents Issued
- 19 US Applications Filed
- 313 Total Citation Count
- Dec 18, 2018 Most Recent Filing
- Sep 17, 1980 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| GENESIS TECHNOLOGY, INC. | 2
| 2002
|
| JAPAN SCIENCE AND TECHNOLOGY AGENCY | 2
1 | 2004
2005 |
| ARAKAWA CHEMICAL INDUSTRIES, LTD. | 2
2 2 | 2010
2011 2013 |
| TOYOTA JIDOSHA KABUSHIKI KAISHA | 2
| 2010
|
| KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) | 4
4 | 2001
2002 |
| Kobe Steel, Ltd. | 1
| 2001
|
| STAR MICRONICS CO., LTD. | 1
| 1996
|
| KOBELCO RESEARCH INSTITUTE, INC. | 1
2 2 | 1994
1995 2006 |
| FUJITSU TEN LIMITED | 2
| 2010
|
| MURATA MANUFACTURING CO., LTD. | 1
| 1980
|
| HARIMA CHEMICALS, INCORPORATED | 2
| 2010
|
| YAMAICHI ELECTRONICS CO., LTD. | 2
| 2002
|
| KOKI COMPANY LIMITED | 2
| 2010
|
| PELNOX CO., LTD. | 2
| 2013
|
| DENSO CORPORATION | 2
| 2010
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hadano, JP | May 24, 16 - May 24, 16 |
| Hadano-shi, JP | Jan 08, 15 - Jan 08, 15 |
| Hyogo, JP | Dec 04, 12 - Dec 04, 12 |
| Kanagawa, JP | Jan 19, 06 - Apr 23, 20 |
| Kobe, JP | May 07, 96 - May 28, 13 |
| Kobe-shi, JP | Oct 18, 01 - Nov 22, 12 |
| Nagaokakyo, JP | Aug 30, 83 - Aug 30, 83 |
| Osaka, JP | Jan 28, 16 - Jan 28, 16 |
| Shizuoka, JP | Aug 25, 98 - Aug 25, 98 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A61N: | ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY | 1 |
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 1 |
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2020/0126,695 | 2020 | CHIP-SHAPED ELECTRONIC COMPONENT | 1 |
| 9346993 | 2016 | Heat dissipating coating composition and heat dissipating coating film | 1 |
| 9314879 | 2016 | Lead-free solder flux and lead-free solder paste | 1 |
| 2016/0024,366 | 2016 | HEAT-DISSAPATING POWDER COATING COMPOSITION, HEAT-DISSIPATING COATING FILM, AND COATED ARTICLE | 2 |
| 2015/0010,759 | 2015 | HEAT DISSIPATING COATING COMPOSITION AND HEAT DISSIPATING COATING FILM | 3 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.