TAIHEI INOUE
Inventor
Stats
- 0 US patents issued
- 9 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 9 US Applications Filed
- 14 Total Citation Count
- Jun 13, 2024 Most Recent Filing
- Aug 18, 2016 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Tokyo, JP | Dec 27, 18 - Oct 03, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C08G: | MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 4 |
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 2 |
| C08L: | COMPOSITIONS OF MACROMOLECULAR COMPOUNDS | 8 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0329,525 | 2024 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | 0 |
| 2024/0210,827 | 2024 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS | 0 |
| 11809079 | 2023 | Photosensitive resin composition, polyimide production method, and semiconductor device | 0 |
| 2023/0221,639 | 2023 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 0 |
| 2022/0269,170 | 2022 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 0 |
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