Noboru Imai
Inventor
Stats
- 3 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 10 US Applications Filed
- 180 Total Citation Count
- Oct 4, 2012 Most Recent Filing
- Jan 16, 1996 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| HITACHI CABLE, LTD. | 2
2 1 4 | 1996
2007 2010 2012 |
| SHINDO COMPANY, LTD. | 1
1 | 2011
2012 |
Inventor Addresses
| Address | Duration |
|---|---|
| Ibaraki, JP | Jan 14, 97 - Nov 17, 98 |
| Takahagi, JP | Mar 09, 10 - Apr 11, 13 |
| Tokyo, JP | Apr 11, 13 - Apr 11, 13 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 2 |
| F21S: | NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF | 1 |
| F21V: | FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2013/0087,367 | 2013 | HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE | 4 |
| 2013/0087,368 | 2013 | HEATING ELEMENT MOUNTING SUBSTRATE, METHOD OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGE | 2 |
| 2013/0001,633 | 2013 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE | 27 |
| 2013/0001,632 | 2013 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE, LED PACKAGE AND METHOD OF MANUFACTURING THE LED PACKAGE | 11 |
| 2013/0001,618 | 2013 | LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LED PACKAGE | 8 |
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