Hajime ITOKAWA
Inventor
Stats
- 0 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 6 US Applications Filed
- 3 Total Citation Count
- Feb 5, 2024 Most Recent Filing
- May 17, 2021 Earliest Filing
Work History
No Work History Available.Inventor Addresses
Address | Duration |
---|---|
Annaka, JP | Oct 31, 23 - Oct 15, 24 |
Annaka-shi, JP | Dec 02, 21 - Aug 08, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
B65B: | MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING | 1 |
B65D: | CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12116304 | 2024 | Method for packing quartz glass cloth | 0 |
12098290 | 2024 | Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder | 0 |
2024/0262,735 | 2024 | METHOD FOR PACKING QUARTZ GLASS CLOTH | 0 |
2024/0174,863 | 2024 | LOW DIELECTRIC SILICA POWDER, RESIN COMPOSITION CONTAINING THE SILICA POWDER, AND METHOD FOR MANUFACTURING LOW DIELECTRIC SILICA POWDER | 0 |
2024/0140,863 | 2024 | Glass Cloth and Method of Manufacture | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.