Natsuko ICHIKAWA
Inventor
Stats
- 0 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 1 US Applications Filed
- 5 Total Citation Count
- Dec 25, 2013 Most Recent Filing
- Dec 25, 2013 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| A SCHOOL CORPORATION KANSAI UNIVERSITY | 1
| 2013
|
| TANAKA KIKINZOKU KOGYO K.K. | 1
| 2013
|
Inventor Addresses
| Address | Duration |
|---|---|
| Osaka, JP | Dec 03, 15 - Dec 03, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C09J: | ADHESIVES; ADHESIVE PROCESSES IN GENERAL | 1 |
| C09K: | MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR | 1 |
| H01B: | CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2015/0344,749 | 2015 | THERMALLY-CONDUCTIVE, ELECTRICALLY-CONDUCTIVE ADHESIVE COMPOSITION | 5 |
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