Wei-Che Huang
Inventor
Stats
- 19 US patents issued
- 41 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 19 US Patents Issued
- 41 US Applications Filed
- 395 Total Citation Count
- Mar 1, 2023 Most Recent Filing
- Jun 11, 1999 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| MEDIATEK INC. | 2
10 1 14 13 3 | 2012
2013 2014 2015 2016 2017 |
| NOVATEK MICROELECTRONICS CORP. | 1
| 2005
|
| UNITED MICROELECTRONICS CORP. | 2
| 1999
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hsin-Tien, TW | Apr 24, 01 - Apr 24, 01 |
| Hsinchu City, TW | Sep 28, 23 - Sep 28, 23 |
| Hsinchu County, TW | Apr 02, 15 - Feb 25, 25 |
| Taipei City, TW | Dec 14, 06 - Dec 14, 06 |
| Taipei, TW | Nov 14, 00 - Nov 14, 00 |
| Zhudong Township, Hsinchu County, TW | Aug 26, 14 - Aug 15, 23 |
| Zhudong Township, TW | Jan 10, 13 - Sep 24, 20 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G09G: | ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION | 1 |
| H01F: | MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 37 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12237401 | 2025 | Semiconductor chip | 0 |
| 2023/0307,316 | 2023 | SEMICONDUCTOR PACKAGE WITH VAPOR CHAMBER LID | 0 |
| 11728292 | 2023 | Semiconductor package assembly having a conductive electromagnetic shield layer | 0 |
| 2022/0406,921 | 2022 | SEMICONDUCTOR CHIP | 0 |
| 11450756 | 2022 | Manufacturing method of semiconductor chip | 1 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.