Wayne H Huang
Inventor
Stats
- 6 US patents issued
- 17 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 17 US Applications Filed
- 86 Total Citation Count
- Jul 15, 2021 Most Recent Filing
- Jun 29, 2012 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
MORGAN STANLEY SENIOR FUNDING, INC. | 1
| 2017
|
U.S. BANK NATIONAL ASSOCIATION | 1
| 2015
|
MICRON TECHNOLOGY, INC. | 2
2 4 2 1 | 2012
2014 2015 2016 2017 |
Inventor Addresses
Address | Duration |
---|---|
Boise, ID, US | Jan 02, 14 - Aug 22, 23 |
Technology Profile
Technology | Matters | |
---|---|---|
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 17 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11735549 | 2023 | Methods and systems for manufacturing pillar structures on semiconductor devices | 0 |
11631630 | 2023 | Pillar-last methods for forming semiconductor devices | 0 |
11239129 | 2022 | Package cooling by coil cavity | 0 |
2021/0343,670 | 2021 | METHODS AND SYSTEMS FOR MANUFACTURING PILLAR STRUCTURES ON SEMICONDUCTOR DEVICES | 3 |
2021/0166,996 | 2021 | PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES | 0 |
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