Hsin-Ting HUANG

Inventor

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Work History

Patent OwnerApplications FiledYear
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
5
8
4
8
17
8
2
3
2010
2011
2012
2013
2014
2015
2016
2017

Inventor Addresses

AddressDuration
Bade City, TWApr 12, 12 - Feb 27, 20
Bade, TWMay 10, 12 - Sep 28, 21
Blade City, TWJun 19, 14 - Jun 19, 14
TAOYUAN COUNTY, TWFeb 23, 17 - Feb 23, 17
Taoyuan County, TWOct 29, 15 - Apr 23, 19

Technology Profile

Technology Matters
B81B: MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 17
B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 21
G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
111306702021MEMS devices with an element having varying widths0
109817812021Semiconductor arrangement and formation thereof0
2020/0062,5872020SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF0
104648082019Semiconductor arrangement and formation thereof0
103922442019Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity8

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