Hsiang-Hung Huang
Inventor
Stats
- 1 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 5 US Applications Filed
- 4 Total Citation Count
- Feb 13, 2023 Most Recent Filing
- Nov 16, 2016 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| UNIMICRON TECHNOLOGY CORP. | 1
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu, TW | Feb 29, 24 - Jun 06, 24 |
| New Taipei City, TW | May 09, 19 - May 09, 19 |
| New Taipei, TW | Jan 30, 18 - Nov 05, 19 |
| Taipei City, TW | Feb 29, 24 - Feb 29, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 4 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0186,323 | 2024 | INTEGRATED CIRCUIT AND MANUFACTURING METHOD THEREOF | 0 |
| 2024/0072,136 | 2024 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 0 |
| 2024/0072,115 | 2024 | COMPLEMENTARY FIELD EFFECT TRANSISTOR WITH CONDUCTIVE THROUGH SUBSTRATE LAYER | 0 |
| 10470317 | 2019 | Method for manufacturing circuit board | 0 |
| 2019/0141,842 | 2019 | METHOD FOR MANUFACTURING CIRCUIT BOARD | 0 |
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