Wen-Fu Hsu
Inventor
Stats
- 1 US patents issued
- 4 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 4 US Applications Filed
- 25 Total Citation Count
- Apr 5, 2017 Most Recent Filing
- Dec 26, 2000 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| YEH-CHIANG TECHNOLOGY CORP. | 1
| 2004
|
| CHIPMOS TECHNOLOGIES INC. | 1
| 2000
|
| ASIA PACIFIC MICROSYSTEMS, INC. | 1
| 2002
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu, TW | May 28, 02 - Feb 05, 19 |
| Tao Yuan Hsien, TW | Dec 29, 05 - Dec 29, 05 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| F21V: | FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR | 1 |
| F21Y: | INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V, RELATING TO THE FORM OF THE LIGHT SOURCES | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10197255 | 2019 | Rail-type OLED lamp assembly | 2 |
| 2018/0128,468 | 2018 | RAIL-TYPE OLED LAMP ASSEMBLY | 2 |
| 2005/0285,257 | 2005 | Encapsulated device with heat isolating structure | 0 |
| 2004/0084,766 | 2004 | System-in-a-package device | 13 |
| 6395584 | 2002 | Method for improving the liquid dispensing of IC packages | 3 |
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