Sen-Kuei HSU
Inventor
Stats
- 6 US patents issued
- 44 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 44 US Applications Filed
- 156 Total Citation Count
- Jun 13, 2024 Most Recent Filing
- Apr 18, 2013 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 2
4 5 3 | 2013
2014 2015 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Kaohsiung City, TW | Sep 18, 14 - Oct 10, 24 |
| Kaohsiung, TW | May 31, 16 - Apr 01, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G01R: | MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES | 9 |
| H01F: | MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES | 2 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 34 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12266648 | 2025 | Package structure | 0 |
| 2024/0339,427 | 2024 | MANUFACTURING METHOD OF PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREOF | 0 |
| 2024/0312,904 | 2024 | METHOD OF FABRICATING PACKAGE STRUCTURE | 0 |
| 2024/0304,561 | 2024 | SEMICONDUCTOR PACKAGE | 0 |
| 12051666 | 2024 | Package structure and manufacturing method of package structure thereof | 0 |
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