Chien-En Hsu
Inventor
Stats
- 3 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 10 US Applications Filed
- 227 Total Citation Count
- Feb 25, 2019 Most Recent Filing
- Dec 19, 2005 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| UNITED MICROELECTRONICS CORP. | 1
3 1 2 2 | 2005
2007 2008 2009 2015 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu County, TW | Oct 13, 09 - Sep 15, 16 |
| Singapore, SG | Nov 08, 18 - Oct 13, 20 |
| Taoyuan County, TW | Jun 21, 07 - Sep 27, 07 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B44C: | PRODUCING DECORATIVE EFFECTS | 2 |
| C03C: | CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS | 2 |
| H01G: | CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10804418 | 2020 | Photodetector and method for fabricating the same | 0 |
| 2020/0235,253 | 2020 | PHOTODETECTOR AND METHOD FOR FABRICATING THE SAME | 0 |
| 10580823 | 2020 | Wafer level packaging method | 9 |
| 2019/0181,119 | 2019 | STACKED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | 3 |
| 2018/0323,227 | 2018 | WAFER LEVEL PACKAGING METHOD | 153 |
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