Jerwei Hsieh
Inventor
Stats
- 8 US patents issued
- 11 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 8 US Patents Issued
- 11 US Applications Filed
- 81 Total Citation Count
- May 3, 2016 Most Recent Filing
- Jul 1, 2002 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
INSTRUMENT TECHNOLOGY RESEARCH CENTER, NATIONAL APPLIED RESEARCH LABORATORIES | 1
| 2007
|
WALSIN LIHWA CORPORATION | 2
4 2 | 2002
2004 2005 |
ASIA PACIFIC MICROSYSTEMS, INC. | 3
2 2 | 2013
2014 2016 |
INSTRUMENT TECHNOLOGY RESEARCH CENTER | 1
| 2007
|
NATIONAL APPLIED RESEARCH LABORATORIES | 2
| 2005
|
Inventor Addresses
Address | Duration |
---|---|
Hsinchu City, TW | Aug 15, 13 - Aug 25, 16 |
Hsinchu, TW | Aug 03, 06 - Jun 13, 17 |
San-chong City, TW | May 20, 04 - Oct 13, 05 |
San-chong, TW | Sep 27, 05 - Feb 20, 07 |
Sanchong City, TW | Nov 25, 04 - Sep 06, 07 |
Sanchong, TW | Aug 08, 06 - Jul 24, 07 |
Technology Profile
Technology | Matters | |
---|---|---|
B01L: | CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE | 1 |
B81B: | MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES | 2 |
B81C: | PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS | 4 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
9676609 | 2017 | Integrated MEMS device | 0 |
2016/0244,323 | 2016 | Integrated MEMS Device | 0 |
9359193 | 2016 | Method for manufacturing an integrated MEMS device | 1 |
2015/0274,514 | 2015 | Integrated Mems Device and Its Manufacturing Method | 0 |
8916449 | 2014 | Package structure and substrate bonding method | 2 |
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