Jer-Wei Hsieh
Inventor
Stats
- 1 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 2 US Applications Filed
- 0 Total Citation Count
- Oct 4, 2023 Most Recent Filing
- Nov 4, 2013 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ASIA PACIFIC MICROSYSTEMS, INC. | 2
| 2013
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu City, TW | May 08, 14 - Aug 29, 24 |
| Hsinchu, TW | Jul 05, 16 - Jul 05, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B81C: | PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS | 1 |
| G02B: | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS | 1 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0292,517 | 2024 | CIRCUIT CARRIER BOARD | 0 |
| 9382113 | 2016 | Method for fabricating a self-aligned vertical comb drive structure | 0 |
| 2014/0126,031 | 2014 | Method for Fabricating a Self-Aligned Vertical Comb Drive Structure | 0 |
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