Huang-Ting Hsiao
Inventor
Stats
- 2 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 6 US Applications Filed
- 27 Total Citation Count
- Aug 9, 2022 Most Recent Filing
- Sep 29, 2005 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 3
1 | 2014
2016 |
| UNITED MICROELECTRONICS CORP. | 1
| 2005
|
Inventor Addresses
| Address | Duration |
|---|---|
| TAOYUAN COUNTY, TW | May 26, 16 - Mar 28, 19 |
| Tao-Yuan Hsien, TW | Mar 29, 07 - Mar 29, 07 |
| Taoyuan County, TW | Dec 03, 15 - Dec 01, 22 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B65D: | CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES | 1 |
| G01R: | MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES | 1 |
| G06K: | RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2022/0384,377 | 2022 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 0 |
| 11495556 | 2022 | Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same | 0 |
| 11018099 | 2021 | Semiconductor structure having a conductive bump with a plurality of bump segments | 1 |
| 2019/0096,832 | 2019 | SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2 |
| 9880220 | 2018 | Edge crack detection system | 2 |
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