Khalil Hosseini
Inventor
Stats
- 81 US patents issued
- 90 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 81 US Patents Issued
- 90 US Applications Filed
- 724 Total Citation Count
- Oct 1, 2018 Most Recent Filing
- Aug 27, 2004 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 2
3 13 21 12 25 32 16 4 2 3 | 2004
2005 2006 2007 2010 2011 2012 2013 2014 2015 2016 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 4
22 1 | 2012
2013 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Weihmichi, DE | Sep 19, 13 - Sep 19, 13 |
| Weihmichl, DE | Mar 03, 05 - Nov 30, 21 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A47J: | KITCHEN EQUIPMENT; COFFEE MILLS; SPICE MILLS; APPARATUS FOR MAKING BEVERAGES | 2 |
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11189537 | 2021 | Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit | 0 |
| 10734352 | 2020 | Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement | 0 |
| 2019/0103,378 | 2019 | Metallic Interconnect, a Method of Manufacturing a Metallic Interconnect, a Semiconductor Arrangement and a Method of Manufacturing a Semiconductor Arrangement | 10 |
| 10153276 | 2018 | Group III heterojunction semiconductor device having silicon carbide-containing lateral diode | 1 |
| 9984897 | 2018 | Method for manufacturing a chip arrangement including a ceramic layer | 0 |
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