Kenji Hosoi
Inventor
Stats
- 5 US patents issued
- 19 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 5 US Patents Issued
- 19 US Applications Filed
- 23 Total Citation Count
- Aug 2, 2021 Most Recent Filing
- Sep 16, 1994 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| KIKKOMAN CORPORATION | 1
| 1994
|
| DAIICHI PURE CHEMICALS CO., LTD. | 2
| 1994
|
| THE NIKKA WHISKY DISTILLING CO., LTD. | 2
1 | 2014
2016 |
| THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK | 1
| 2013
|
| CENTRAL GLASS COMPANY, LIMITED | 4
2 1 | 2006
2007 2013 |
| IDEMITSU KOSAN CO., LTD. | 2
1 | 2014
2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Chiyoda-ku, Tokyo, JP | Sep 14, 23 - Sep 28, 23 |
| Kashiwa, JP | Aug 20, 19 - Sep 27, 22 |
| Kashiwa-shi, Chiba, JP | Feb 09, 17 - Feb 09, 17 |
| Kashiwa-shi, JP | Nov 03, 16 - Jan 10, 19 |
| Kasukabe, JP | Jun 09, 09 - Feb 01, 11 |
| Kawagoe, JP | Jun 16, 20 - Sep 24, 24 |
| Kawagoe-shi, Saitama, JP | Nov 14, 19 - Oct 12, 23 |
| Saitama, JP | Apr 23, 09 - May 06, 10 |
| Saitama-ken, JP | Apr 03, 14 - Apr 03, 14 |
| Tokyo, JP | Feb 27, 96 - Sep 24, 96 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 3 |
| C01B: | NON-METALLIC ELEMENTS; COMPOUNDS THEREOF | 1 |
| C02F: | TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12098238 | 2024 | Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin | 0 |
| 2023/0323,030 | 2023 | Polyamide, Polyamide-Imide, Derivatives of These, Optical Film, Display Device, and Production Methods Therefor | 0 |
| 2023/0303,480 | 2023 | Polybenzoxazole, Polyamide, Polyamide Solution, Insulating Material for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Equipment, Insulating Material for Producing High-Frequency Electronic Component, Method for Producing Polyamide, Method for Producing Polybenzoxazole, Method for Producing Insulating Material for High-Frequency Electronic Component, and Diamine or Salt Thereof | 0 |
| 2023/0287,178 | 2023 | Fluorinated Diamine or Salt Thereof, Method for Producing Fluorinated Diamine or Salt Thereof, Polyamide, Method for Producing Polyamide, Polyamide Solution, Cyclized Polyamide, Method for Producing Cyclized Polyamide, Insulation for High-Frequency Electronic Component, Method for Producing Insulation for High-Frequency Electronic Component, High-Frequency Electronic Component, High-Frequency Appliance, and Insulating Material for Producing High-Frequency Electronic Component | 0 |
| 2023/0125,986 | 2023 | Novolak Resin, Epoxy Resin, Photosensitive Resin Composition, Curable Resin Composition, Cured Substance, Electronic Device, Production Method for Novolak Resin, and Production Method for Epoxy Resin | 0 |
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