Stephen Ryan Hooper
Inventor
Stats
- 2 US patents issued
- 21 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 21 US Applications Filed
- 56 Total Citation Count
- Sep 11, 2023 Most Recent Filing
- Dec 23, 2002 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
NORTH STAR INNOVATIONS INC. | 2
| 2002
|
NXP USA, INC. | 1
| 2017
|
Inventor Addresses
Address | Duration |
---|---|
Chandler, AZ, US | Feb 04, 21 - May 17, 22 |
Mesa, AZ | Mar 21, 06 - Mar 21, 06 |
Mesa, AZ, US | Jun 24, 04 - Jun 18, 24 |
Queen Creek, AZ, US | Feb 23, 23 - Mar 13, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
B81B: | MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES | 5 |
B81C: | PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS | 3 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0085,182 | 2025 | LOW STRESS PACKAGING FOR ENVIRONMENTAL SENSORS | 0 |
2025/0079,335 | 2025 | VIBRATION ISOLATION ASSEMBLIES FOR ELECTRONIC DEVICES | 0 |
2024/0425,367 | 2024 | DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT | 0 |
2024/0425,364 | 2024 | DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT | 0 |
2024/0332,105 | 2024 | MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE | 0 |
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