Shou-Yu Hong
Inventor
Stats
- 15 US patents issued
- 23 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 15 US Patents Issued
- 23 US Applications Filed
- 292 Total Citation Count
- Sep 27, 2018 Most Recent Filing
- Jan 2, 2009 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| CYNTEC CO., LTD. | 1
| 2015
|
| DELTA ELECTRONICS, INC. | 2
3 6 2 4 2 4 | 2009
2010 2011 2012 2013 2015 2016 |
| DELTA ELECTRONICS (SHANGHAI) CO., LTD. | 2
3 4 2 2 | 2013
2014 2015 2016 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Pudong, CN | Oct 07, 10 - Dec 02, 10 |
| Shanghai, CN | Jul 09, 09 - Aug 13, 19 |
| TAOYUAN HSIEN, CN | Aug 22, 13 - Aug 22, 13 |
| Taoyuan City, TW | Dec 08, 16 - Mar 22, 18 |
| Taoyuan Hsien, CN | Mar 15, 16 - Mar 15, 16 |
| Taoyuan Hsien, TW | Jan 19, 12 - Jul 16, 13 |
| Taoyuan, TW | Nov 14, 17 - Feb 12, 19 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 1 |
| C08L: | COMPOSITIONS OF MACROMOLECULAR COMPOUNDS | 1 |
| G11B: | INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10381286 | 2019 | Power module | 0 |
| 10314178 | 2019 | Package module | 0 |
| 10276520 | 2019 | Switch circuit package module | 0 |
| 10204882 | 2019 | Stacked package module having an exposed heat sink surface from the packaging | 0 |
| 2019/0037,706 | 2019 | PACKAGE MODULE | 0 |
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