Koji Hojo

Inventor

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Work History

Patent OwnerApplications FiledYear
SHINKAWA LTD.
1
2
2012
2015

Inventor Addresses

AddressDuration
Tokyo, JPJun 20, 13 - Mar 21, 17

Technology Profile

Technology Matters
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2
H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1

Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
96032622017Electronic component mounting apparatus and method1
2016/0029,4942016ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD0
2013/0153,6442013ELECTRONIC COMPONENT MOUNTING APPARATUS AND METHOD8

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