Josef Hoeglauer
Inventor
Stats
- 59 US patents issued
- 95 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 59 US Patents Issued
- 95 US Applications Filed
- 772 Total Citation Count
- Aug 20, 2024 Most Recent Filing
- Jun 14, 2006 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
INFINEON TECHNOLOGIES AG | 8
13 10 8 6 9 22 5 3 3 | 2006
2007 2008 2009 2010 2011 2012 2013 2014 2015 |
INFINEON TECHNOLOGIES AUSTRIA AG | 1
2 2 21 1 3 2 1 | 2007
2011 2012 2013 2014 2015 2016 2017 |
POLARIS INNOVATIONS LIMITED | 2
| 2007
|
Inventor Addresses
Address | Duration |
---|---|
Haimstetten, DE | Oct 10, 17 - Oct 10, 17 |
Heimstetten, DE | Jun 14, 12 - Feb 25, 25 |
Helmstetten, DE | Jun 11, 13 - Nov 21, 17 |
Kirchheim-Heimstette, DE | Mar 05, 15 - Sep 20, 16 |
Kirchheim-Heimstetten, DE | Mar 15, 12 - Aug 25, 15 |
Kirchhein-Heimstetten, DE | Jan 02, 14 - Sep 29, 15 |
Muenchen, DE | Mar 01, 07 - Oct 01, 15 |
Munchen, DE | Dec 20, 07 - Nov 27, 08 |
Munich, DE | May 05, 09 - Jun 16, 15 |
Technology Profile
Technology | Matters | |
---|---|---|
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
H01F: | MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES | 4 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 91 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12237246 | 2025 | Semiconductor devices including parallel electrically conductive layers | 0 |
12218038 | 2025 | Leadframe, semiconductor package and method | 0 |
12205919 | 2025 | Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module | 0 |
2024/0413,127 | 2024 | Method of Forming a Semiconductor Module | 0 |
12087740 | 2024 | Method of forming a semiconductor module | 0 |
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