Josef Hoeglauer

Inventor

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Work History

Patent OwnerApplications FiledYear
INFINEON TECHNOLOGIES AG
8
13
10
8
6
9
22
5
3
3
2006
2007
2008
2009
2010
2011
2012
2013
2014
2015
INFINEON TECHNOLOGIES AUSTRIA AG
1
2
2
21
1
3
2
1
2007
2011
2012
2013
2014
2015
2016
2017
POLARIS INNOVATIONS LIMITED
2
2007

Inventor Addresses

AddressDuration
Haimstetten, DEOct 10, 17 - Oct 10, 17
Heimstetten, DEJun 14, 12 - Feb 25, 25
Helmstetten, DEJun 11, 13 - Nov 21, 17
Kirchheim-Heimstette, DEMar 05, 15 - Sep 20, 16
Kirchheim-Heimstetten, DEMar 15, 12 - Aug 25, 15
Kirchhein-Heimstetten, DEJan 02, 14 - Sep 29, 15
Muenchen, DEMar 01, 07 - Oct 01, 15
Munchen, DEDec 20, 07 - Nov 27, 08
Munich, DEMay 05, 09 - Jun 16, 15

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2
H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 4
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 91

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
122372462025Semiconductor devices including parallel electrically conductive layers0
122180382025Leadframe, semiconductor package and method0
122059192025Method of processing a semiconductor wafer, semiconductor die, and method of producing a semiconductor module0
2024/0413,1272024Method of Forming a Semiconductor Module0
120877402024Method of forming a semiconductor module0

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