Yen-Teng Ho
Inventor
Stats
- 3 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 10 US Applications Filed
- 23 Total Citation Count
- Jul 30, 2024 Most Recent Filing
- Sep 8, 2010 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 2
1 | 2014
2016 |
| NATIONAL CHIAO TUNG UNIVERSITY | 1
2 3 1 | 2010
2013 2014 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu City, TW | Oct 06, 22 - Nov 28, 24 |
| Hsinchu, TW | Oct 10, 23 - Jan 28, 25 |
| Tainan City, TW | Mar 17, 11 - Jan 01, 15 |
| Tainan, TW | Dec 30, 14 - Feb 13, 18 |
| Zhubei City, TW | Apr 18, 24 - Apr 18, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C30B: | SINGLE-CRYSTAL GROWTH | 2 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 9 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12211789 | 2025 | Three dimensional integrated circuit and fabrication thereof | 0 |
| 2024/0395,698 | 2024 | THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF | 0 |
| 2024/0128,363 | 2024 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 0 |
| 2023/0378,056 | 2023 | THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF | 0 |
| 11784119 | 2023 | Three dimensional integrated circuit and fabrication thereof | 0 |
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