Tsutomu Hiyama
Inventor
Stats
- 7 US patents issued
- 18 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 18 US Applications Filed
- 69 Total Citation Count
- Oct 17, 2023 Most Recent Filing
- Dec 21, 2004 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
Senju Metal lndustry Co., Ltd. | 1
| 2013
|
SENJU METAL INDUSTRY CO., LTD. | 3
2 7 4 1 | 2004
2006 2013 2014 2015 |
Inventor Addresses
Address | Duration |
---|---|
Katsusika-ku, JP | Aug 02, 11 - Aug 02, 11 |
Tokyo, JP | Nov 19, 09 - Feb 08, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
B01D: | SEPARATION | 5 |
B05B: | SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES | 1 |
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 18 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2024/0042,539 | 2024 | Soldering Apparatus And Method Of Detecting Failures Of Gasket | 0 |
11819952 | 2023 | Soldering apparatus and method of detecting failures of gasket | 0 |
2023/0347,437 | 2023 | SOLDERING DEVICE | 0 |
2022/0126,236 | 2022 | CONDENSATION DEVICE, FLUX RECOVERY DEVICE, SOLDERING DEVICE, WATER VAPOR REMOVING METHOD, FLUX RECOVERY METHOD AND SOLDER PROCESSING METHOD | 0 |
11235407 | 2022 | Soldering apparatus and method of fixing gasket to the soldering apparatus | 0 |
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