Michael J Hill
Inventor
Stats
- 22 US patents issued
- 49 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 22 US Patents Issued
- 49 US Applications Filed
- 951 Total Citation Count
- Apr 13, 2022 Most Recent Filing
- Aug 27, 1987 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| RENISHAW PLC | 1
| 2001
|
| SENSIPASS LTD. | 2
| 2012
|
| INTEL CORPORATION | 2
4 1 2 1 4 | 2004
2005 2006 2012 2014 2015 |
| WILD BLUE TECHNOLOGIES, INC. | 1
| 2016
|
| XEROX CORPORATION | 1
1 1 | 1995
2001 2003 |
| CHATSWORTH PRODUCTS, INC. | 1
| 2002
|
| UNISYS CORPORATION | 1
1 1 3 1 8 5 | 1989
1993 1994 1997 2001 2004 2010 |
| AUTOLIV ASP, INC. | 1
| 1996
|
Inventor Addresses
| Address | Duration |
|---|---|
| 3305 Daisy, Pasadena, TX 77505 | Oct 25, 88 - Oct 25, 88 |
| Cedar Falls, IA | Apr 12, 07 - Apr 12, 07 |
| Gilbert, AZ | Jun 14, 07 - Jun 05, 08 |
| Gilbert, AZ, US | Mar 02, 06 - Jun 27, 23 |
| Logan, UT | Apr 14, 98 - Apr 14, 98 |
| Milwaukee, WI, US | Jul 10, 14 - Apr 25, 19 |
| New Bern, NC | Sep 02, 03 - Sep 02, 03 |
| Portland, OR, US | Dec 22, 16 - Jun 29, 21 |
| Rochester, NJ | Aug 05, 04 - Aug 05, 04 |
| Rochester, NY | Jun 24, 97 - Nov 25, 03 |
| Vadnais Heights, MN | Mar 09, 93 - Mar 14, 06 |
| Vadnais Heights, MN, US | Aug 04, 09 - Feb 16, 16 |
| Wotton-under-Edge, GB | Feb 14, 02 - Feb 14, 02 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B06B: | GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL | 1 |
| B23Q: | DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING | 1 |
| B27G: | ACCESSORY MACHINES OR APPARATUS; TOOLS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11690165 | 2023 | Package substrate inductor having thermal interconnect structures | 0 |
| 11527489 | 2022 | Apparatus and system with package stiffening magnetic inductor core and methods of making the same | 0 |
| 11437346 | 2022 | Package structure having substrate thermal vent structures for inductor cooling | 2 |
| 2022/0240,370 | 2022 | PACKAGE SUBSTRATE INDUCTOR HAVING THERMAL INTERCONNECT STRUCTURES | 2 |
| 11357096 | 2022 | Package substrate inductor having thermal interconnect structures | 1 |
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