Robert Hettler
Inventor
Stats
- 6 US patents issued
- 53 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 53 US Applications Filed
- 77 Total Citation Count
- Jul 22, 2024 Most Recent Filing
- Apr 9, 2003 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SCHOTT AG | 2
4 3 2 3 1 1 2 | 2003
2009 2012 2013 2014 2015 2016 2017 |
| Scott AG | 1
| 2006
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kumhause, DE | Jan 16, 14 - Jun 30, 15 |
| Kumhausen, DE | Oct 13, 05 - Nov 14, 24 |
| Kumshausen, DE | Dec 29, 16 - Dec 29, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A61B: | DIAGNOSIS; SURGERY; IDENTIFICATION | 5 |
| A61C: | DENTISTRY; APPARATUS OR METHODS FOR ORAL OR DENTAL HYGIENE | 1 |
| A61L: | METHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION, OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0379,340 | 2024 | METAL FIXING MATERIAL LEADTHROUGH HAVING LOW SUSCEPTIBILITY TO FAULTS | 0 |
| 12125696 | 2024 | Metal fixing material leadthrough having low susceptibility to faults | 0 |
| 12084374 | 2024 | Method for producing glass wafers for packaging electronic devices, and electronic component produced according to the method | 0 |
| 2024/0186,035 | 2024 | ELECTRICAL FEEDTHROUGH | 0 |
| 11993511 | 2024 | Hermetically sealed, toughened glass package and method for producing same | 0 |
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