Junyeong HEO
Inventor
Stats
- 1 US patents issued
- 17 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 17 US Applications Filed
- 37 Total Citation Count
- Jul 23, 2024 Most Recent Filing
- Aug 9, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 2
| 2015
|
Inventor Addresses
| Address | Duration |
|---|---|
| SUWON-SI, KR | Mar 25, 21 - Oct 12, 23 |
| Suwon-si, KR | Mar 17, 16 - Jan 09, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 17 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0015,025 | 2025 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 0 |
| 2024/0379,478 | 2024 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 0 |
| 2024/0312,823 | 2024 | METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING AND SEMICONDUCTOR CHIP SPLIT BY THE SAME | 0 |
| 12094794 | 2024 | Semiconductor package and method of fabricating the same | 0 |
| 2024/0203,946 | 2024 | SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND WAFER DICING METHOD | 0 |
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