Craig Henry
Inventor
Stats
- 5 US patents issued
- 7 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 5 US Patents Issued
- 7 US Applications Filed
- 180 Total Citation Count
- Mar 29, 2019 Most Recent Filing
- Oct 17, 2005 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| FEI COMPANY | 2
4 1 | 2005
2006 2012 |
| Rowe, Kenneth S. | 1
| 2013
|
| MICROSOFT TECHNOLOGY LICENSING, LLC | 1
| 2006
|
Inventor Addresses
| Address | Duration |
|---|---|
| Aloha, OR | Nov 29, 07 - Sep 09, 08 |
| Aloha, OR, US | Jan 25, 07 - Mar 31, 09 |
| Hillsboro, OR, US | Sep 26, 13 - Oct 26, 21 |
| Wilmington, MA, US | Nov 22, 16 - Nov 22, 16 |
| Woodinville, WA | Dec 20, 07 - Dec 20, 07 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A01C: | PLANTING; SOWING; FERTILISING | 1 |
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 1 |
| G01N: | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11158487 | 2021 | Diagonal compound mill | 0 |
| 2020/0312,618 | 2020 | DIAGONAL COMPOUND MILL | 0 |
| 9653260 | 2017 | High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella | 3 |
| 9501588 | 2016 | Garden simulation | 4 |
| 2013/0248,354 | 2013 | High Throughput TEM Preparation Processes and Hardware for Backside Thinning of Cross-Sectional View Lamella | 26 |
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